漆膜附著力測(cè)試

Film adhesion testing of thin films and stacks on substrates for material evaluation

3DIC TSV and BWS TTV硅片表面形貌測(cè)量
Film Stress薄膜應(yīng)力量測(cè)儀
FEOL Electrical Characterization 電學(xué)特性
Thin wafer metrology 晶圓測(cè)量學(xué)
Film Adhesion漆膜附著力測(cè)試

Film adhesion testing
of thin films and stacks on substrates
for material evaluation. 
FSM offers two techniques suitable for low and medium adhesion strength tests.

Film adhesion testing of thin films and stacks on substrates for material evaluation