光刻機，鍍膜機，磁控濺射鍍膜儀，電子束蒸發鍍膜儀，開爾文探針系統(功函數測量)，氣溶膠設備，氣溶膠粒徑譜儀，等離子增強氣相沉積系統(PECVD)，原子層沉積系統(ALD)，快速退火爐，氣溶膠發生器，稀釋器，濾料測試系統
四袋電子束蒸發器
儀器簡介：
The e-flux Mini E-Beam Evaporator is an UHV evaporator for small and medium quantities of almost any material in the temperature
range of 400K to 3100K. Evaporation is possible either directly from evaporant in rod form (?26mm)
or out of a crucible. An integrated flux monitor allows maximum deposition control.
Highly efficient watercooling ensures negligible outgassing during operation.
The e-flux electron beam evaporator is very compact and mounted on a CF-40 flange (2.75"OD).
很容易安裝在已經有的 UHV 或 MBE系統上。
主要應用是：表面科學，薄膜沉積，薄膜摻雜
主要蒸發材料： Mo, Ta, W, Au, Ag, Pt, Al, Cu, Ni, Ti, C, Si, Cr
四袋電子束蒸發器
技術參數：
真空腔體內長度: 190mm (without options). Special length possible on request.
最大真空端直徑: 34mm
安裝法蘭口徑: NW40CF (2.75"OD)
烘烤溫度: max. 200°C
rod feed棒材: 25mm, optionally 50mm
坩堝體積: 0,3ccm
坩堝材料: Mo, Ta, W, pyrol. Graphite, BN liner, Al2O3, Quartz
沉積速率: from <0,01A/s to >2nm/s
束流發散角: ±15° (±12° with flux monitor)
電子束功率: max. 600W
控制器: 19" rack mount, 3U high,
230VAC/50Hz
選項:
擋板 (manual and motorised)
flux monitor/flux controller, Deposition Controller*
熱電偶
離子阱
各種坩堝 (see above) with end caps for horizontal mount
motorised rod feed
control options (schematic)
主要特點：
獨有特點:
1,發射電流穩定性:
The emission current stabilizer is a closed loop control to keep the emission
current constant automatically with rod melting down or decrease of crucible content
2,LED提示棒材位置
An LED alerts when the evaporation rod has to be fed. Threshold can be customer set.
3,可輸入需要的發射電流
The emission current can now be set directly on a linear scale for easy reproduction.
4,離子阱選項
The ion trap option allows to deflect all charged particles out of the beam.
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